сухие молочные смеси для детей без пальмового масла
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сухие молочные смеси для детей без пальмового масла, Applied Materials | NIST, Materials | NIST - National Institute of Standards and Technology, Guides and Materials: CHIPS R&D Funding Opportunities, Standard Reference Materials | NIST, NIST’s Curved Neutron Beams Could Deliver Benefits Straight to Industry, Materials characterization - NIST, Materials Genome Initiative | NIST.
PurposeThe U.S. Department of Commerce awarded Applied Materials, Inc. $100 million in direct funding to develop and scale a disruptive silicon-core substrate technology for next-generation advances in packaging and 3D heterogeneous integration. Key demonstrator technologies for advanced packaging will be validated through this program. These advanced substrates are physical platforms that allow multiple semiconductor chips to be assembled seamlessly together, enable high-bandwidth communication between those chips, efficiently deliver power, and dissipate unwanted heat. Expected Outcomes Along with a team of 10 collaborators, Applied Materials silicon-core substrate technology has the potential to advance America’s leadership in advanced packaging and help catalyze an ecosystem to develop and build next-generation energy-efficient artificial intelligence (AI) and high-performance computing (HPC) systems in the US. Leadership for advanced 300mm silicon packaging substrates and materials will be achieved by meeting the aggressive targets set in this project. Silicon-core substrates will enhance key advanced packaging technologies, including but not limited to equipment, tools, processes, and process integration. Workforce Development Applied Materials will work with university partners to provide internships and graduate research opportunities for graduate, undergraduate, and training in community colleges for students in advanced packaging, chiplet integration in fabrication facilities, and chiplet/substrate design. Educational modules will be developed to support ASTM certifications across important microelectronic manufacturing processes. About the CHIPS National Advanced Packaging Manufacturing Program (NAPMP) To enable the CHIPS Research and Development Office’s vision for success, the CHIPS NAPMP will make approximately $3 billion in investments to develop critical and relevant innovations for advanced packaging technologies and accelerate their scaled transition to U.S. manufacturing entities. These investments will include research programs for core technologies that can be scaled to high-volume manufacturing, an advanced packaging piloting facility to support this scaling, resources to support the expansion of advanced packaging solutions, and workforce development. As a result, within a decade, NAPMP-funded activities, coupled with CHIPS manufacturing incentives, will establish a vibrant, self-sustaining, high-volume, domestic, advanced packaging industry where advanced-node chips manufactured in the United States are packaged in the United States. The technology developed will be leveraged in new applications and market sectors and at scale. Financial Summary Program CHIPS NAPMP Direct Funding Amount $100 million Expected Co-Investment $54 million Read the full CHIPS for America press release by . Learn more about the CHIPS NAPMP by . , Expected Outcomes . Along with a team of 10 collaborators, Applied Materials silicon-core substrate technology has the potential to advance America’s leadership in advanced packaging and help catalyze an ecosystem to develop and build next-generation energy-efficient artificial intelligence (AI) and high-performance computing (HPC) systems in the US., Plastics, carbon nanotubes, high-strength alloys, artificial bone and joint replacements are just some of the emerging materials for which NIST develops testbeds, defines benchmarks, and develops formability measurements and models..
These materials are for informational purposes only and are intended solely to assist potential applicants in better understanding the CHIPS R&D application requirements. They do not, and are not intended to, supersede, modify, or otherwise alter applicable statutory or regulatory requirements or the specific requirements set forth in any CHIPS , NIST supports accurate and compatible measurements by certifying and providing over 1200 Standard Reference Materials® with well-characterized composition or properties, or both, This achievement could enhance neutron-based techniques for investigating the properties of materials that are difficult to explore by other means. For example, the beams can probe characteristics of molecules such as chirality, which is important in biotechnology, chemical manufacturing, quantum computing and other fields., Project activities include: Electronic structure of semiconductor-oxide interfaces. Thermodynamics of flexible microporous materials for gas storage Gas adsorption in microporous materials Analysis of topological materials, including magnetic topological insulators High-throughput screening of, Materials Resource Registry This system allows for the registration of materials resources, bridging the gap between existing resources and the end users. Data Repositories and Lists Repositories establish essential data exchange protocols and mechanisms for widespread adoption to ensure quality materials data and models and to foster data , NIST Property Data Summaries for Advanced Materials This database provides physical characteristics (crystallography data, density), mechanical properties (elastic moduli, strength, hardness, toughness, creep, wear), and thermal properties (specific heat, diffusivity, conductivity, expansion) for advanced materials. Read More: SRD 154.